CHIP

specialized in the design of multi-component integrated circuits, mainly SiP – System in Package type, for IoT applications. It has a complete set of Cadence design tools plus Ansys, Comsol and Labview simulation tools for testing. Also, it has a set of digital, analog and RF test and characterization tools, in addition to having the entire prototyping infrastructure of the itt Chip (SMT and Packaging Laboratories). It has a multidisciplinary team of designers and specialists, around 12, in packaging, RF, firmware, digital design and testing. The Design Center works in direct partnership with HT Micron Semiconductors, allowing the products (mainly SiPs) developed to be produced in volume at the HT Micron factory. After design validation, the products can be transferred to immediate production at HT.

Laboratory that has software tools and 4 workstations (high performance computers) used in the design and simulation of printed circuit boards, mechanical parts and multiphysics simulations of sensors and devices. Among the tools we can highlight Solidworks, Altium Designer, complete package of Ansys Electromagnetics licenses and COMSOL Multphysics tool (29 modules). In this laboratory, all stages of design and evaluation by simulation of microdevices, sensors and packaging can be carried out.

The Laboratory has desktop computers, symmetric sources, oscilloscopes, multimeters, passive components and several development kits for embedded software with controllers from the manufacturers Atmel, Texas Instruments and ST Microelectronics, in addition to kits with FPGA devices from the company Xilinx.

This laboratory has essential equipment for prototyping the packaging of devices and sensors such as: gold, silver and copper wire welder (TPT HB16), adhesive and packaging dispenser (Nordson EV-Series), plasma etching of 600W (PE-200 -Plasmaetch), DC welder (Sunstone WH2125A), stereo microscope (Zeiss Stemi 508) and Laser and Chemical Decap.

The SMT laboratory has a complete line for the manufacture and assembly of printed circuit boards as it has an LPKF D104 board prototyping machine with milling and laser tools for small dimensions, hole metallizer, paste applicator weld (by screen printing), component positioner (pick and place TWS-EVO) and 5-zone reflow oven.

The Flexible Electronics Laboratory has equipment for the preparation and characterization of various materials, mainly for flexible electronics applications such as conductive inks based on nanomaterials, semiconductor polymers and conductive adhesives. It has a high resolution ink-jet printer (Dimatix DMP 2831), four-point resistivity meter (Signatone Pro4-4000), high-speed centrifuge (Hitachi CF15RN), profilometer (KLA-TENCOR D-500 ), galvanostat potentiostat (Autolab PG-302N), oven (ETHIK 400-3ND), ultrasonic bath (ALPAX LSUC2-120-3.0, 40Hz 120W) , pH meter (TECNAL TEC-5), magnetic stirrer with heating (Tecnal TE-0851), vortex mixer (Kasvi), analytical and semi analytical balance (Sartorius and Shimatdzu) and chemical hood (Produlab).

The photolithography laboratory has equipment capable of defining microstructures with minimum dimensions of up to 1 µm, sufficient for the manufacture of sensors, MEMS, packaging, and microfluidic devices. It has two spin coaters for the application of films and photoresists (Sawatec SMD-200 and Laurell WS-650Hz), hot plate (Sawatec HP-200), photoresist developer (Sawatec SM-200) and laser microwriter (ML-3 Durham Magneto Optics). It also has a vacuum and atmospheric pressure oven (Ethik), a film laminator (Fortex 304), a hood
for cleaning and chemical removal with acidic solutions and another for solvents (with controlled temperature and ultrasound baths).

The Microfabrication laboratory has a set of equipment that allows depositing and removing metallic and dielectric thin films, in addition to an oven for thermal treatments. It has a sputtering equipment (Alliance Concept, AC450) capable of depositing metallic films such as Al, Ti, Cu, Cr and Au (DC magnetron sputtering) and dielectrics such as SiO2, Si3N4, Si, Al2O3 (RF sputtering). An Oxford Plasma Pro100 Cobra plasma etching equipment powered by 8 different gases capable of etching metals (CL2 and HBr gases) and dielectrics (SF6, CHF3, C4F8, He, Ar and O2 gases). A rapid thermal annealing furnace (JetFirst 200 C) capable of reaching up to 1,100 °C. Photolithography and microfabrication laboratory equipment are capable of processing wafers of 4, 6 and up to 8 inches in diameter.

The reliability laboratory has equipment to perform accelerated life tests, simulating the real environments in which the products are submitted to evaluate the quality of the materials and processes used in the manufacture of the products. It has a saline mist chamber (certified by INMETRO), a burn in chamber, a thermal shock chamber, a thermal cycling chamber with temperature and humidity control, a HAST - Highly Accelerated Stress Test chamber and vibration testing equipment.

The microscopy laboratory has equipment for qualitative and quantitative evaluation of chemical elements as it has a scanning electron microscope (SEM) and chemical analysis with EDS (Energy Dispersive Spectroscopy), atomic force microscope, ultrasonic scanning microscope (SAM), metallographic microscope in addition to a series of equipment and materials for sample preparation.